參數(shù)資料
型號(hào): AM41DL6408H8H70IS
廠商: Advanced Micro Devices, Inc.
英文描述: TV 6C 6#20 PIN WALL RECP
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 57/66頁(yè)
文件大小: 1123K
代理商: AM41DL6408H8H70IS
November 24, 2003
Am41DL6408H
55
A D V A N C E I N F O R M A T I O N
AC CHARACTERISTICS
Figure 30.
SRAM Read Cycle
Notes:
1. WE# = V
IH
, if CIOs is low, ignore UB#s/LB#s timing.
2. t
HZ
and t
OHZ
are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output
voltage levels.
3. At any given temperature and voltage condition, t
HZ
(Max.) is less than t
LZ
(Min.) both for a given device and from device to device
interconnection.
Data Valid
High-Z
t
RC
CE#1s
Address
OE#
Data Out
t
OH
t
AA
t
CO1
t
OE
t
OLZ
t
BLZ
t
LZ
t
OHZ
t
HZ
CE2s
t
CO2
相關(guān)PDF資料
PDF描述
AM41DL6408H8H70IT TV 6C 6#20 PIN WALL RECP
AM41DL6408H8H71IS Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:6; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
AM41DL6408H8H71IT TV 6C 6#20 PIN WALL RECP
AM41DL6408H8H85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H8H70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM