參數(shù)資料
型號(hào): AM41DL6408H8H70IS
廠(chǎng)商: Advanced Micro Devices, Inc.
英文描述: TV 6C 6#20 PIN WALL RECP
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 63/66頁(yè)
文件大?。?/td> 1123K
代理商: AM41DL6408H8H70IS
November 24, 2003
Am41DL6408H
61
A D V A N C E I N F O R M A T I O N
PHYSICAL DIMENSIONS
FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
相關(guān)PDF資料
PDF描述
AM41DL6408H8H70IT TV 6C 6#20 PIN WALL RECP
AM41DL6408H8H71IS Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:6; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
AM41DL6408H8H71IT TV 6C 6#20 PIN WALL RECP
AM41DL6408H8H85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H8H70IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IS 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IS 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM