參數(shù)資料
型號(hào): AP603-F
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 放大器
英文描述: 800 MHz - 2200 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: 6 X 5 MM, ROHS COMPLIANT, MO-229VJGC, SMT, DFN-14
文件頁數(shù): 11/20頁
文件大小: 1165K
代理商: AP603-F
AP603
High Dynamic Range 7W 28V HBT Amplifier
Mechanical Information
Package Information and Dimensions
This package is lead-free and RoHS-
compliant. It is compatible with both lead-
free (maximum 260
C reflow temperature)
and leaded (maximum 245
C reflow
temperature) soldering processes.
The
plating material on the pins is annealed
matte tin over copper.
The component will be laser marked with
an “AP603-F” product identifier with an
alphanumeric lot code on the top surface of
the package.
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Data Sheet: Rev A 07/02/11
-
19 of 20 -
Disclaimer: Subject to change without notice
2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network
Notes:
1.
Ground/Thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80/.0135”) diameter and
have a final, plated thru diameter of .25mm (.010”).
2.
Add as much copper as possible to inner and outer layers near the part to ensure optimal performance.
3.
To ensure reliable operation, device ground paddle-to-ground pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a heatsink. Ensure that the ground/thermal via region contacts the
heatsink.
5.
Do not put solder mask on the back side of the PC Board in the region where the board contacts the heatsink.
6.
RF trace width depends upon the width of the PC board material and construction.
7.
Use 1 oz. copper minimum
8.
A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the
device can occure without one
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