參數(shù)資料
型號: APTCV60TLM70T3G
廠商: MICROSEMI POWER PRODUCTS GROUP
元件分類: IGBT 晶體管
英文描述: 80 A, 600 V, N-CHANNEL IGBT
封裝: ROHS COMPLIANT, SP3, 32 PIN
文件頁數(shù): 6/11頁
文件大?。?/td> 281K
代理商: APTCV60TLM70T3G
APTCV60TLM70T3G
APT
C
V60T
LM
70T
3G
Rev
0
Mar
ch,
2009
www.microsemi.com
4- 11
CR5 & CR6 diode ratings and characteristics
Symbol
Characteristic
Test Conditions
Min
Typ
Max
Unit
VRRM
Maximum Peak Repetitive Reverse Voltage
600
V
Tj = 25°C
25
IRM
Maximum Reverse Leakage Current
VR=600V
Tj = 125°C
500
A
IF
DC Forward Current
Tc = 80°C
30
A
IF = 30A
1.8
2.2
IF = 60A
2.2
VF
Diode Forward Voltage
IF = 30A
Tj = 125°C
1.5
V
Tj = 25°C
25
trr
Reverse Recovery Time
Tj = 125°C
160
ns
Tj = 25°C
35
Qrr
Reverse Recovery Charge
IF = 30A
VR = 400V
di/dt =200A/s
Tj = 125°C
480
nC
Err
Reverse Recovery Energy
IF = 30A
VR = 400V
di/dt =1000A/s
Tj = 125°C
0.6
mJ
RthJC
Junction to Case Thermal Resistance
1.2
°C/W
CR2, CR3, CR7 & CR8 diode ratings and characteristics
Symbol
Characteristic
Test Conditions
Min
Typ
Max
Unit
VRRM
Maximum Peak Repetitive Reverse Voltage
1200
V
Tj = 25°C
100
IRM
Maximum Reverse Leakage Current
VR=1200V
Tj = 125°C
500
A
IF
DC Forward Current
Tc = 80°C
30
A
IF = 30A
2.6
3.1
IF = 60A
3.2
VF
Diode Forward Voltage
IF = 30A
Tj = 125°C
1.8
V
Tj = 25°C
300
trr
Reverse Recovery Time
Tj = 125°C
380
ns
Tj = 25°C
360
Qrr
Reverse Recovery Charge
IF = 30A
VR = 800V
di/dt =200A/s
Tj = 125°C
1700
nC
Err
Reverse Recovery Energy
IF = 30A
VR = 800V
di/dt =1000A/s
Tj = 125°C
1.6
mJ
RthJC
Junction to Case Thermal Resistance
1.2
°C/W
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
Characteristic
Min
Typ
Max
Unit
R25
Resistance @ 25°C
50
k
Ω
R25/R25
5
%
B25/85
T25 = 298.15 K
3952
K
B/B
TC=100°C
4
%
=
T
B
R
T
1
exp
25
85
/
25
T: Thermistor temperature
RT: Thermistor value at T
相關(guān)PDF資料
PDF描述
APTGV50H120BTPG 75 A, 1200 V, N-CHANNEL IGBT
AR0001 MOBILE STATION ANTENNA
AR0001 MOBILE STATION ANTENNA
ARA2000S23TR RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
AT30TS750-XM8-T DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 3Cel, SQUARE, SURFACE MOUNT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APTCV60TLM991G 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:Three level inverter CoolMOS & Trench + Field Stop IGBT Power Module
APTCV60TLM99T3G 功能描述:POWER MODULE IGBT QUAD 600V SP3 RoHS:是 類別:半導(dǎo)體模塊 >> IGBT 系列:- 標(biāo)準(zhǔn)包裝:10 系列:GenX3™ IGBT 類型:PT 配置:單一 電壓 - 集電極發(fā)射極擊穿(最大):600V Vge, Ic時的最大Vce(開):1.4V @ 15V,100A 電流 - 集電極 (Ic)(最大):430A 電流 - 集電極截止(最大):100µA Vce 時的輸入電容 (Cies):31nF @ 25V 功率 - 最大:1000W 輸入:標(biāo)準(zhǔn) NTC 熱敏電阻:無 安裝類型:底座安裝 封裝/外殼:SOT-227-4,miniBLOC 供應(yīng)商設(shè)備封裝:SOT-227B
APTCV90TL12T3G 功能描述:POWER MODULE IGBT QUAD 900V SP3 RoHS:是 類別:半導(dǎo)體模塊 >> IGBT 系列:- 標(biāo)準(zhǔn)包裝:10 系列:GenX3™ IGBT 類型:PT 配置:單一 電壓 - 集電極發(fā)射極擊穿(最大):600V Vge, Ic時的最大Vce(開):1.4V @ 15V,100A 電流 - 集電極 (Ic)(最大):430A 電流 - 集電極截止(最大):100µA Vce 時的輸入電容 (Cies):31nF @ 25V 功率 - 最大:1000W 輸入:標(biāo)準(zhǔn) NTC 熱敏電阻:無 安裝類型:底座安裝 封裝/外殼:SOT-227-4,miniBLOC 供應(yīng)商設(shè)備封裝:SOT-227B
APTD1608CGCK 功能描述:標(biāo)準(zhǔn)LED-SMD SMD Green 570nm 230mcd RoHS:否 制造商:Vishay Semiconductors 封裝 / 箱體:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明顏色:Red 波長/色溫:631 nm 透鏡顏色/類型:Water Clear 正向電流:30 mA 正向電壓:2 V 光強(qiáng)度:54 mcd 顯示角:130 deg 系列:VLMx1500 封裝:Reel
APTD1608LCGCK 功能描述:LED GREEN CLEAR 2SMD 制造商:kingbright 系列:- 包裝:剪切帶(CT) 零件狀態(tài):在售 顏色:綠色 透鏡顏色:無色 透鏡透明度:透明 毫燭光等級:8mcd 透鏡樣式/尺寸:圓形,帶圓頂,0.70mm 電壓 - 正向(Vf)(典型值):2.65V 電流 - 測試:2mA 視角:60° 安裝類型:表面貼裝 波長 - 主:570nm 波長 - 峰值:574nm 特性:- 封裝/外殼:0603(1608 公制) 供應(yīng)商器件封裝:1608 大小/尺寸:1.60mm 長 x 0.80mm 寬 高度(最大值):1.05mm 標(biāo)準(zhǔn)包裝:1