參數(shù)資料
型號(hào): CY7C1021CV33-10ZIT
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: SRAM
英文描述: 64K X 16 STANDARD SRAM, 10 ns, PDSO44
封裝: TSOP2-44
文件頁數(shù): 10/14頁
文件大?。?/td> 554K
代理商: CY7C1021CV33-10ZIT
CY7C1021CV33
Document Number: 38-05132 Rev. *H
Page 5 of 14
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
8
pF
COUT
Output Capacitance
8pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
SOJ
TSOP II
FBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51
65.06
76.92
95.32
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
34.21
15.86
10.68
°C/W
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms [4]
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
3.3V
OUTPUT
30 pF*
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
(b)
R 317
R2
351
Rise Time: 1 V/ns
Fall Time: 1 V/ns
30 pF*
OUTPUT
Z = 50
50
1.5V
(c)
(a)
3.3V
OUTPUT
5 pF
(d)
R 317
R2
351
8-ns devices:
10-, 12-, 15-ns devices:
High-Z characteristics:
Note
4. AC characteristics (except High-Z) for all 8-ns parts are tested using the load conditions shown in Figure (a). All other speeds are tested using the Thevenin load shown
in Figure (b). High-Z characteristics are tested for all speeds using the test load shown in Figure (d).
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