參數(shù)資料
型號: DS21FF42
廠商: Maxim Integrated Products
文件頁數(shù): 1/114頁
文件大小: 0K
描述: IC FRAMER T1 4X4 16CH 300-BGA
產品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 40
控制器類型: T1 調幀器
接口: 并行/串行
電源電壓: 2.97 V ~ 3.63 V
電流 - 電源: 300mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 300-BBGA
供應商設備封裝: 300-PBGA(27x27)
包裝: 管件
1 of 114
080702
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: http://www.maxim-ic.com/errata.
FEATURESP
§ 16 or 12 completely independent T1 framers
in one small 27mm x 27mm, 1.27mm pitch
BGA package
§ Each multichip module (MCM) contains
four (FF) or three (FT) DS21Q42 die
§ Each quad framer can be concatenated into a
single 8.192MHz backplane data stream
§ IEEE 1149.1 JTAG-Boundary Scan
Architecture
§ DS21FF42 and DS21FT42 are pin
compatible with DS21FF44 and DS21FT44,
respectively, to allow the same footprint to
support T1 and E1 applications
§ 300-pin MCM 1.27mm pitch BGA package
(27mm x 27mm)
§ Low-power 3.3V CMOS with 5V tolerant
input and outputs
APPLICATIONS
§ DSLAMs
§ Multiplexers/Demultiplexers
§ Switches
§ High-Density Line Cards
ORDERING INFORMATION
PART
CHANNEL
PIN-PACKAGE
TEMP RANGE
DS21FT42
12
300 BGA, 27mm x 27mm
0°C to +70°C
DS21FT42N
12
300 BGA, 27mm x 27mm
-40°C to +85°C
DS21FF42
16
300 BGA, 27mm x27mm
0°C to +70°C
DS21FF42N
16
300 BGA, 27mm x 27mm
-40°C to +85°C
1. MULTICHIP MODULE DESCRIPTION
The 4 x 4 and 4 x 3 multichip modules (MCM) offer a high-density packaging arrangement for the
DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these
devices is packaged in an MCM with the electrical connections as shown in Figure 1-1.
All of the functions available on the DS21Q42 are also available in the MCM packaged version.
However, in order to minimize package size, some signals have been deleted or combined. These
differences are detailed in Table 1-1. In the 4 x 3 (FT) version, the fourth quad framer is not populated
and hence all of the signals to and from this fourth framer are absent and should be treated as No
Connects (NC). Table 2-1 lists all of the signals on the MCM and it also lists the absent signals for the
4 x 3.
The availability of both a 12-channel and a 16-channel version allow the maximum framer density with
the lowest cost. For example, in a T3 application, two devices (one DS21FF42 and one DS21FT42)
provide 28 framers without the additional cost and power consumption of any unused framers that appear
in an octal approach.
DS21FT42/DS21FF42
4 x 3 12-Channel T1 Framer
4 x 4 16-Channel T1 Framer
www.maxim-ic.com
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DS21FF42+ 功能描述:網絡控制器與處理器 IC 4x4 16/4x3 12 Chnl T1/T1 Framer RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21FF42N 功能描述:網絡控制器與處理器 IC RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21FF42N+ 功能描述:網絡控制器與處理器 IC 4x4 16/4x3 12 Chnl T1/T1 Framer RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21FF44 功能描述:網絡控制器與處理器 IC 4x4 16/4x3 12 Chnl E1/E1 Framer RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21FF44N 功能描述:網絡控制器與處理器 IC RoHS:否 制造商:Micrel 產品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray