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參數(shù)資料
| 型號： | DSP56852VFE |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 16-bit Digital Signal Controllers |
| 中文描述： | 16位數(shù)字信號控制器 |
| 文件頁數(shù)： | 44/48頁 |
| 文件大?。?/td> | 731K |
| 代理商： | DSP56852VFE |
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56852 Technical Data, Rev. 8
44
Freescale Semiconductor
As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the
first definition. From a practical standpoint, that value is also suitable for determining the junction
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple
reading on the case of the package will estimate a junction temperature slightly hotter than actual. Hence,
the new thermal metric, Thermal Characterization Parameter, or
Ψ
JT
, has been defined to be (T
J
– T
T
)/P
D
.
This value gives a better estimate of the junction temperature in natural convection when using the surface
temperature of the package. Remember that surface temperature readings of packages are subject to
significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat
loss to the sensor. The recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
6.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation:
Provide a low-impedance path from the board power supply to each V
DD
pin on the device, and from the
board ground to each V
SS
(GND) pin.
The minimum bypass requirement is to place six 0.01–0.1
μ
F capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the ten V
DD
/V
SS
pairs, including V
DDA
/V
SSA.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip V
DD
and V
SS
(GND)
pins are less than 0.5 inch per capacitor lead.
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for V
DD
and GND.
Bypass the V
DD
and GND layers of the PCB with approximately 100
μ
F, preferably with a high-grade
capacitor such as a tantalum capacitor.
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal.
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the V
DD
and GND circuits.
All inputs must be terminated (i.e., not allowed to float) using CMOS levels.
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate voltage level.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSP56853 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| DSP56853E | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| DSP56853FG120 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 120Mhz/120MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| DSP56853FGE | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 120Mhz/120MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| DSP56853PB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56853 Digital Signal Processor Product Brief |
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