參數(shù)資料
型號(hào)： EDE5108AHSE-6E-E
廠商： ELPIDA MEMORY INC
元件分類： DRAM
英文描述： 64M X 8 DDR DRAM, 0.45 ns, PBGA60
封裝： ROHS COMPLIANT, FBGA-60
文件頁(yè)數(shù)： 9/64頁(yè)
文件大小： 871K
代理商： EDE5108AHSE-6E-E
Datasheet
DD2.x
Preliminary
PowerPC 750CL Microprocessor
750cl_ds_body.fm.2.4
May 29, 2007
Electrical and Thermal Characteristics
Page 17 of 65
3.2 AC Electrical Characteristics
This section provides the AC electrical characteristics for the 750CL. After fabrication, parts are sorted by
maximum processor core frequency as shown in Section 3.3, Clock Specifications, on page 18 and tested for
conformance to the AC specifications for that frequency. The processor core frequency is determined by the
bus (SYSCLK) frequency and the settings of the PLL configuration (PLL_CFG[0:4]) signals.
Table 3-5. Power Consumption
See Table 3-2 on page 15 for recommended operating conditions.
Mode
Part Number
VDD Range
(For Reference)
Frequency
(MHz)
TJ
(
°C)
NominaI
VDD (V)
Power
(W)
Notes
Maximum
IBMPPC750CLGEQ40xx
0.90 V to 1.00 V
400
105
0.95
1.7
1, 2, 4
Maximum
IBMPPC750CLGEQ50xx
0.95 V to 1.05 V
500
105
1.00
2.0
1, 2, 4
Maximum
IBMPPC750CLGEQ60xx
1.00 V to 1.10 V
600
105
1.05
2.7
1, 2, 4
Maximum
IBMPPC750CLGEQ73xx
1.10 V to 1.20 V
733
105
1.15
4.8
1, 2, 4
Maximum
IBMPPC750CLGEQ80xx
1.10 V to 1.20 V
800
105
1.15
5.6
1, 2, 4
Maximum
IBMPPC750CLGEQ90xx
1.15 V to 1.25 V
900
105
1.20
8.4
1, 2, 4
Maximum
IBMPPC750CLGEQA0xx
1.24 V to 1.30 V
1000
105
1.27
10.5
1, 2, 4
Nap/Sleep
Maximum
IBMPPC750CLGEQ40xx
—
400
50
0.95
0.4
1, 2, 4
Nap/Sleep
Maximum
IBMPPC750CLGEQ50xx
—
500
50
1.00
0.52
1, 2, 4
Nap/Sleep
Maximum
IBMPPC750CLGEQ60xx
—
600
50
1.05
0.68
1, 2, 4
Notes:
1. These values apply for all valid 60× buses. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD). OVDD
power is system dependent, but is typically less than 2% of VDD power.
2. For each part number, maximum power is measured at nominal VDD and at the indicated TJ and frequency, using parts with worst-
case process parameters and running RC5-72. RC5-72 runs hotter than typical production code, but it is possible to design code
that runs even hotter than RC5-72.
3. For each part number, typical power is an estimate of the average value modeled for process parameter parts in a system execut-
ing typical applications at the indicated nominal VDD, frequency, and TJ. Note that typical power cannot be used in the design of the
power supply or cooling system.
4. Previous IBM PowerPC processors specified the power dissipation of the processor without regard to the part number. In contrast,
the 750CL power dissipation specification is specific to a particular part number. Each power specification is specific to four condi-
tions: processor part number, processor actual operating frequency, processor actual junction temperature, and processor actual
VDD.
5. Information on derating the power dissipation of the 750CL over temperature is expected to be available in the second quarter of
2007. Contact ppcsupp@us.ibm.com for information.
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