參數(shù)資料
型號(hào): EMBMOD133
廠商: Intel Corp.
英文描述: Intel Embedded Processor Module(英特爾嵌入式微處理器模塊)
中文描述: 英特爾嵌入式處理器模塊(英特爾嵌入式微處理器模塊)
文件頁數(shù): 10/32頁
文件大?。?/td> 324K
代理商: EMBMOD133
Intel Embedded Processor Module Thermal Design Guide
10
Application Note
The design optimization of a thermal solution is not trivial. The designer must consider the
following parameters when designing a high-performance, low-cost thermal solution:
Surrounding ICs
Maximum power of all components
Ambient and case temperatures
Module orientation
Direction of airflow
Heat source area
Top/bottom heat dissipation of component
Manufacturability
Tooling for testing and manufacturing
Fin profile (round, oval, square, convoluted, folded or corrugated)
Unidirectional vs. omnidirectional fins
Fin geometry (height, thickness, and distance between fins)
Base plate geometry (thickness and area)
Material (aluminum, copper, and alloy)
Heat sink attachment mechanism
Heat sink attachment material (grease, dry-film, thermal tape)
Heat sink attachment thickness and coverage area
Heat sink surface treatment (e.g., anodizing)
Safety/caution labels
UL recognition (or equivalent)
Available pressure drop
Appendix A lists vendors for heat sink fans, heatpipes, pins, springs, heat sink attach/interface
materials, and measurement equipment. The current PCB manufacturer and the address for
requests for copies of the CompactPCI Specification are also listed.
7.1
Extruded Heat Sink
The EMBMOD133 uses an extruded, unidirectional heat sink that meets the CompactPCI form-
factor requirement with a height of 0.275 inches (6.98 mm), and can dissipate the Pentium
processor’s maximum power of 7.9 W. This cooling solution was demonstrated to meet the 95° C
case temperature and a 50° C ambient temperature. The amount of airflow required can change
depending on where the system fan is located. The module’s orientation in the system (Figure 11)
determines how much airflow is needed.
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