參數(shù)資料
型號(hào): EMBMOD133
廠商: Intel Corp.
英文描述: Intel Embedded Processor Module(英特爾嵌入式微處理器模塊)
中文描述: 英特爾嵌入式處理器模塊(英特爾嵌入式微處理器模塊)
文件頁(yè)數(shù): 16/32頁(yè)
文件大?。?/td> 324K
代理商: EMBMOD133
Intel Embedded Processor Module Thermal Design Guide
16
Application Note
7.7
Heat Sink Handling Safety Precaution
The heat sink temperature should not rise above 95° C at worst-case power conditions. Intel
requires a safety label or stamp to be placed on the heat sink as a warning to indicate that this part
is hot. The safety label uses the caution/attention symbols (ISO 7000, # 0434 and IEC 417, # 5041)
to provide this warning, as shown in Figure 9.
Caution:
Allow the heat sink to cool to room temperature before removing the heat sink from the module.
7.8
Heat Sink Removal and Attachment
Intel does
not
recommend removing the heat sink from the Embedded Processor Module. But if
you must remove the heat sink for a custom thermal solution, care must be taken not to damage the
module or any components on the module. Custom thermal solutions must also ensure that
maximum case temperatures for all components on the Embedded Processor Module are not
exceeded.
Warning:
Damage to the board or components voids the warranty of the module.
7.8.1
Removing the Extruded Heat Sink
The following procedure
must
be followed when removing the extruded heat sink from the
EMBMOD133:
Caution:
Allow the heat sink to cool to room temperature before removing the heat sink from the module.
1. Wear a grounding strap at all times when handling the modules to protect against electrostatic
discharge.
2. Use needle-nose pliers to gently squeeze the nose of each push pin together and push the pins
through the module.
Figure 9. Heat Sink Safety Label or Stamp
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