TA = 25°C, unless otherwis" />
參數(shù)資料
型號: EVAL-AD7879-1EBZ
廠商: Analog Devices Inc
文件頁數(shù): 39/41頁
文件大?。?/td> 0K
描述: BOARD EVALUATION FOR AD7879-1
標準包裝: 1
主要目的: 接口,觸摸屏控制器
嵌入式:
已用 IC / 零件: AD7879-1
主要屬性: 4 線電阻式觸控屏控制器,I²C 和 SPI 接口
次要屬性: 圖形用戶界面,USB 接口
已供物品: 板,線纜,CD,觸控屏
AD7879/AD7889
Rev. C | Page 6 of 40
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VCC to GND
0.3 V to +3.6 V
Analog Input Voltage to GND
0.3 V to VCC + 0.3 V
AUX/VBAT to GND
0.3 V to +5 V
Digital Input Voltage to GND
0.3 V to VCC + 0.3 V
Digital Output Voltage to GND
0.3 V to VCC + 0.3 V
Input Current to Any Pin Except Supplies1
10 mA
ESD Rating (X+, Y+, X, Y)
Air Discharge Human Body Model
15 kV
Contact Human Body Model
10 kV
ESD Rating (All Other Pins)
Human Body Discharge
4 kV
Field-Induced Charged Device Model
1 kV
Machine Model
0.2 kV
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Power Dissipation
WLCSP (4-Layer Board)
866 mW
LFCSP (4-Layer Board)
2.138 W
IR Reflow Peak Temperature
260°C (±0.5°C)
Lead Temperature (Soldering 10 sec)
300°C
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type1
θJA
Unit
12-Ball WLCSP
75
°C/W
16-Lead LFCSP
30.4
°C/W
1
4-layer board.
200A
IOL
200A
IOH
1.4V
TO OUTPUT
PIN
CL
50pF
07667-
004
Figure 4. Circuit Used for Digital Timing
ESD CAUTION
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