參數(shù)資料
型號(hào): EVAL-ADUC7024QSZ
廠商: Analog Devices Inc
文件頁數(shù): 104/104頁
文件大?。?/td> 0K
描述: KIT DEV QUICK START ADUC7024
產(chǎn)品培訓(xùn)模塊: ARM7 Applications & Tools
Intro to ARM7 Core & Microconverters
設(shè)計(jì)資源: ADUC7024 Dev System Schematic/Brd Outline
7024 Gerber Files
標(biāo)準(zhǔn)包裝: 1
系列: QuickStart™ 套件
類型: MCU
適用于相關(guān)產(chǎn)品: ADuC7024
所含物品: 評(píng)估板、電源、纜線、軟件和說明文檔
Data Sheet
ADuC7019/20/21/22/24/25/26/27/28/29
Rev. F | Page 99 of 104
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
05
17
06
-A
0.15
0.05
1.45
1.40
1.35
0.20
0.09
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
3.5°
TOP VIEW
(PINS DOWN)
1
21
41
40
60
61
80
20
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
1.60
MAX
0.75
0.60
0.45
VIEW A
PIN 1
14.20
14.00 SQ
13.80
12.20
12.00 SQ
11.80
Figure 100. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-1)
Dimensions shown in millimeters
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
03
09
07
-B
BALL DIAMETER
6.10
6.00 SQ
5.90
A
4.55 SQ
0.65
A1 CORNER
INDEX AREA
TOP VIEW
BOTTOM VIEW
SEATING
PLANE
DETAIL A
0.45
0.40
0.35
COPLANARITY
0.10
0.15 MIN
BALL A1
PAD CORNER
DETAIL A
*1.40 MAX
0.65 MIN
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
1.50
SQ
Figure 101. 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-64-4)
Dimensions shown in millimeters
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