參數(shù)資料
型號: GS8324Z72GC-133IT
廠商: GSI TECHNOLOGY
元件分類: SRAM
英文描述: 512K X 72 ZBT SRAM, 10 ns, PBGA209
封裝: 14 X 22 MM, 1 MM PITCH, BGA-209
文件頁數(shù): 23/46頁
文件大?。?/td> 1157K
代理商: GS8324Z72GC-133IT
Rev: 1.00 10/2001
3/46
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8324Z18(B/C)/GS8324Z36(B/C)/GS8324Z72(C)
GS8324Z36C Pad Out
209-Bump BGA—Top View
1
2
3
4
5
6
7
8
9
10
11
A
NC
A13
E2
A14
ADV
A15
E3
A17
DQB1
DQB5
A
B
NC
BC
NC
A19
W
A16
BB
NC
DQB2
DQB6
B
C
NC
BD
NC
E1
NC
BA
DQB3
DQB7
C
D
NC
VSS
NC
G
NC
VSS
DQB4
DQB8
D
E
NC
DQPC9
VDDQ
VDD
VDDQ
NC
DQPB9
E
F
DQC4
DQC8
VSS
ZQ
VSS
NC
F
G
DQC3
DQC7
VDDQ
VDD
MCH
VDD
VDDQ
NC
G
H
DQC2
DQC6
VSS
MCL
VSS
NC
H
J
DQC1
DQC5
VDDQ
VDD
MCH
VDD
VDDQ
NC
J
K
NC
CK
NC
VSS
MCL
VSS
NC
K
L
NC
VDDQ
VDD
FT
VDD
VDDQ
DQA5
DQA1
L
M
NC
VSS
MCL
VSS
DQA6
DQA2
M
N
NC
VDDQ
VDD
MCH
VDD
VDDQ
DQA7
DQA3
N
P
NC
VSS
ZZ
VSS
DQA8
DQA4
P
R
DQPD9
NC
VDDQ
VDD
VDDQ
DQPA9
NC
R
T
DQD8
DQD4
VSS
NC
LBO
PE
NC
VSS
NC
T
U
DQD7
DQD3
NC
A12
NC
A11
A18
A10
NC
U
V
DQD6
DQD2
A9
A8
A7
A1
A6
A5
A4
NC
V
W
DQD5
DQD1
TMS
TDI
A3
A0
A2
TDO
TCK
NC
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
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