參數(shù)資料
型號: GS840E18GB-100T
廠商: GSI TECHNOLOGY
元件分類: SRAM
英文描述: 256K X 18 CACHE SRAM, 12 ns, PBGA119
封裝: BGA-119
文件頁數(shù): 8/31頁
文件大?。?/td> 629K
代理商: GS840E18GB-100T
Rev: 2.05 6/2000
16/31
1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
.
GS840E18/32/36T/B-180/166/150/100
Note: This parameter is sample tested.
Notes:
1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
2. SCMI G-38-87.
3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.
Capacitance
(TA=25oC, f=1MHZ, VDD=3.3V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Control Input Capacitance
CI
VDD=3.3V
3
4
pF
Input Capacitance
CIN
VIN=0V
4
5
pF
Output Capacitance
COUT
VOUT=0V
6
7
pF
Package Thermal Characteristics
Rating
Layer Board
Symbol
TQFP Max
BGA Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
RΘJA
40
38
°C/W
1,2,4
Junction to Ambient (at 200 lfm)
four
RΘJA
24
21
°C/W
1,2,4
Junction to Case (TOP)
RΘJC
9
5
°C/W
3,4
20% tKC
VSS-2.0V
50%
VSS
VIH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
VDD+-2.0V
50%
VDD
VIL
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GS840E18T-150 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
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