參數(shù)資料
型號(hào): IDT71P73204
廠(chǎng)商: Integrated Device Technology, Inc.
英文描述: 18Mb Pipelined DDR⑩II SRAM Burst of 4
中文描述: 35.7流水線(xiàn)的DDR II SRAM的突發(fā)⑩4
文件頁(yè)數(shù): 4/25頁(yè)
文件大?。?/td> 648K
代理商: IDT71P73204
6.42
IDT71P73204 (2M x 8-Bit), 71P73104 (2M x 9-Bit), 71P73804 (1M x 18-Bit) 71P73604 (512K x 36-Bit)
18 Mb DDR II SRAM Burst of 4 Commercial Temperature Range
Pin Definitions continued
Symbol
Pin Function
Description
Doff
Input
DLL Turn Off. When low this input will turn off the DLL inside the device. The AC timngs with the DLL
turned off will be different fromthose listed in this data sheet. There wll be an increased propagation
delay fromthe incidence of C and
C
to DQ, or K and
K
to DQ as configured. The propagation delay is not
a tested parameter but wll be simlar to the propagation delay of other SRAM devices in this speed
grade.
TDO
Output
TDO pin for JTAG
TCK
Input
TCK pin for JTAG.
TDI
Input
TDI pin for JTAG. An internal resistor will pull TDI to V
DD
when the pin is unconnected.
TMS
Input
TMS pin for JTAG. An internal resistor wll pull TMS to V
DD
when the pin is unconnected.
NC
No
Connect
No connects inside the package. Can be tied to any voltage level
V
REF
Input
Reference
Reference Voltage input. Static input used to set the reference level for HSTL inputs and Outputs as well
as AC measurement points.
V
DD
Power
Supply
Power supply inputs to the core of the device. Should be connected to a 1.8V power supply.
V
SS
Ground
Ground for the device. Should be connected to ground of the system
V
DDQ
Power
Supply
Power supply for the outputs of the device. Should be connected to a 1.5V power supply for HSTL or
scaled to the desired output voltage.
6431 tbl 02b
相關(guān)PDF資料
PDF描述
IDT71P73204167BQ 18Mb Pipelined DDR⑩II SRAM Burst of 4
IDT71P73204200BQ 18Mb Pipelined DDR⑩II SRAM Burst of 4
IDT71P73204250BQ 18Mb Pipelined DDR⑩II SRAM Burst of 4
IDT71P73604 18Mb Pipelined DDR⑩II SRAM Burst of 4
IDT71P73604167BQ 18Mb Pipelined DDR⑩II SRAM Burst of 4
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT71P73604S167BQ 功能描述:IC SRAM 18MBIT 167MHZ 165FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:378 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-CBGA 供應(yīng)商設(shè)備封裝:48-CBGA(7x7) 包裝:托盤(pán)
IDT71P73604S167BQ8 功能描述:IC SRAM 18MBIT 167MHZ 165FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:378 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-CBGA 供應(yīng)商設(shè)備封裝:48-CBGA(7x7) 包裝:托盤(pán)
IDT71P73604S200BQ 功能描述:IC SRAM 18MBIT 200MHZ 165FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:378 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-CBGA 供應(yīng)商設(shè)備封裝:48-CBGA(7x7) 包裝:托盤(pán)
IDT71P73604S200BQ8 功能描述:IC SRAM 18MBIT 200MHZ 165FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:378 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-CBGA 供應(yīng)商設(shè)備封裝:48-CBGA(7x7) 包裝:托盤(pán)
IDT71P73604S250BQ 功能描述:IC SRAM 18MBIT 250MHZ 165FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:378 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-CBGA 供應(yīng)商設(shè)備封裝:48-CBGA(7x7) 包裝:托盤(pán)