參數(shù)資料
型號: IRF7534D1
廠商: International Rectifier
英文描述: Co-packaged HEXFET Power MOSFET and Schottky Diode(同封裝 HEXFET晶體管和肖特基二極管)
中文描述: 共同封裝的HEXFET功率MOSFET和肖特基二極管(同封裝的HEXFET晶體管和肖特基二極管)
文件頁數(shù): 1/8頁
文件大?。?/td> 106K
代理商: IRF7534D1
FETKY
MOSFET & Schottky Diode
3/22/00
IRF7534D1
Absolute Maximum Ratings
www.irf.com
1
Thermal Resistance
Parameter Max.
Maximum Junction-to-Ambient
Units
100 °C/W
R
θ
JA
Notes:
Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)
I
SD
-1.2A, di/dt
100A/μs, V
DD
V
(BR)DSS
, T
J
150°C
Pulse width
300μs – duty cycle
2%
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
Parameter
Max.
-20
-4.3
-3.4
-34
1.25
0.8
Units
V
V
DS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
Linear Derating Factor 10 mW/°C
V
GS
Gate-to-Source Voltage
± 12 V
dv/dt
Peak Diode Recovery dv/dt
T
J
, T
STG
Junction and Storage Temperature Range
Drain-Source Voltage
Continuous Drain Current, V
GS
@ -4.5V
Continuous Drain Current, V
GS
@ -4.5V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
A
W
W
1.1
V/ns
°C
-55 to + 150
V
DSS
= -20V
R
DS(on)
= 0.055
Schottky Vf=0.39V
Micro8
G
Co-packaged HEXFET
power
MOSFET and Schottky diode
G
Ultra Low On-Resistance
MOSFET
G
Trench technology
G
Micro8
TM
Footprint
G
Available in Tape & Reel
Description
PD -93864
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the designer
an innovative, board space saving solution for switching regulator and power
management applications. International Rectifier utilizes advanced processing
techniques to achieve extremely low on-resistance per silicon area. Combining this
technology with International Rectifier’s low forward drop Schottky rectifiers results in
an extremely efficient device suitable for use in a wide variety of portable electronics
applications, such as cell phones, PDAs, etc.
The Micro8
TM
package makes an ideal device for applications where printed circuit
board space is at a premium. The low profile (<1.1mm) of the Micro8
TM
will allow it to
fit easily into extremely thin application environments such as portable electronics
Top View
8
1
2
3
4
5
6
7
A
A
S
G
D
D
K
K
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