FN6316.1 July 15, 2010 Absolute Maximum Ratings Thermal Information Voltage on VDD
參數(shù)資料
型號(hào): ISL1221IUZ-T
廠商: Intersil
文件頁數(shù): 18/24頁
文件大?。?/td> 0K
描述: IC RTC LP BATT BACK SRAM 10MSOP
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1
類型: 時(shí)間事件記錄器
特點(diǎn): 警報(bào)器,閏年,SRAM
存儲(chǔ)容量: 2B
時(shí)間格式: HH:MM:SS(12/24 小時(shí))
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 5.5 V
電壓 - 電源,電池: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 1245 (CN2011-ZH PDF)
其它名稱: ISL1221IUZ-TDKR
3
FN6316.1
July 15, 2010
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT, SCL, SDA, and IRQ/EVDET Pins
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Voltage on X1 and X2 Pins
(respect to ground) . . . . . . . . . . . .-0.5V to VDD + 0.5 (VDD Mode)
-0.5V to VBAT + 0.5 (VBAT Mode)
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . .>2kV
ESD Rating (Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . .>175V
Output Current Sink (FOUT, IRQ . . . . . . . . . . . . . . . . . . . . . . . . 3mA
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
10Ld MSOP Package. . . . . . . . . . . . . . . . . . . . . . . .
120
Moisture Sensitivity (see Technical Brief TB363). . . . . . . . . . Level 2
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
VDD Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
VBAT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Operating Characteristics – RTC Test Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 9)
TYP
(Note 5)
MAX
(Note 9)
UNITS NOTES
VDD
Main Power Supply
2.7
5.5
V
VBAT
Battery Supply Voltage
1.8
5.5
V
IDD1
Supply Current
VDD = 5V
2
6
A
VDD = 3V
1.2
4
A
IDD2
Supply Current With I2C Active
VDD = 5V
40
120
A
IDD3
Supply Current (Low Power Mode)
VDD = 5V, LPMODE = 1
1.4
5
A
2, 8
IBAT
Battery Supply Current
VBAT = 3V
400
950
nA
IBATLKG
Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
ILI
Input Leakage Current on SCL
100
nA
ILO
I/O Leakage Current on SDA
100
nA
VTRIP
VBAT Mode Threshold
1.6
2.2
2.64
V
VTRIPHYS
VTRIP Hysteresis
10
35
60
mV
VBATHYS
VBAT Hysteresis
10
50
100
mV
EVIN
VIL
-0.3
0.3 x VDD
V
VIH
0.7 x VDD
VDD + 0.3
V
Hysteresis
0.05 x VDD
V
IEVPU
EVIN Pullup Current
VSUP = 3V
1.5
A
IRQ/EVDET and FOUT
VOL
Output Low Voltage
VDD = 5V, IOL = 3mA
0.4
V
VDD = 2.7V, IOL = 1mA
0.4
V
ILO
Output Leakage Current
VDD = 5.5V
VOUT = 5.5V
100
400
nA
Power-Down Timing Test Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 9)
TYP
(Note 5)
MAX
(Note 9)
UNITS
NOTES
VDD SR-
VDD Negative Slew rate
10
V/ms
ISL1221
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