參數(shù)資料
型號： ISP1362EE
廠商： NXP SEMICONDUCTORS
元件分類： 總線控制器
英文描述： Single-chip Universal Serial Bus On-The-Go controller
中文描述： UNIVERSAL SERIAL BUS CONTROLLER, PBGA64
封裝： 6 X 6 MM, 0.80 HEIGHT, PLASTIC, MO-195, SOT-543-1, TFBGA-64
文件頁數(shù)： 147/150頁
文件大?。?/td> 647K
代理商： ISP1362EE
Philips Semiconductors
ISP1362
Single-chip USB OTG controller
Product data
Rev. 03
—
06 January 2004
147 of 150
9397 750 12337
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to re
fl
ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared re
fl
ow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the re
fl
ow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is de
fi
nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is de
fi
nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on
fl
ex foil. However, the image sensor package can be mounted by the client on a
fl
ex
foil by using a hot bar soldering process. The appropriate soldering pro
fi
le can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1362EE,518 功能描述:USB 接口集成電路 USB OTG HOST RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1362EE,551 功能描述:USB 接口集成電路 DO NOT USE ORDER -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1362EE,557 功能描述:USB 接口集成電路 DO NOT USE ORDER -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1362EE/01 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single-chip Universal Serial Bus On-The-Go controller
ISP1362EE-S 功能描述:IC USB CTRL SNGL CHIP 64TFBGA RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
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