型號(hào): | M36L0R7050B0ZAQE |
廠商: | 意法半導(dǎo)體 |
英文描述: | ER 23C 16 12 8 4 SKT RECP WALL |
中文描述: | 128兆位(多銀行,多層次,突發(fā))閃存32兆位(200萬(wàn)× 16)移動(dòng)存儲(chǔ)芯片,1.8V電源多芯片封裝 |
文件頁(yè)數(shù): | 14/18頁(yè) |
文件大?。?/td> | 406K |
代理商: | M36L0R7050B0ZAQE |
相關(guān)PDF資料 |
PDF描述 |
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M36L0R7050T0ZAQE | AB 6C 2#0 4#4 SKT RECP |
M36L0R7050T0ZAQT | 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
M36L0R7050T0ZAQF | 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
M36W108 | 8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product |
M36W108ATZM | 8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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M36L0R7050B0ZAQF | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
M36L0R7050B0ZAQT | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
M36L0R7050B1ZAQE | 制造商:Micron Technology Inc 功能描述:128M (8MX16) FLASH, 32M PSRAM, 1.8V, TFBGA88, IND, HAZMAT - Trays |
M36L0R7050B3ZAQE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
M36L0R7050B3ZAQF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |