MAX11040K/MAX11060
24-/16-Bit, 4-Channel, Simultaneous-Sampling,
Cascadable, Sigma-Delta ADCs
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = +3.0V to +3.6V, VDVDD = +2.7V to VAVDD, fXIN CLOCK = 24.576MHz, fOUT = 16ksps, VREFIO = +2.5V (external), CREFIO =
CREF0 = CREF1 = CREF2 = CREF3 = 1μF to AGND, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +4V
DVDD to DGND ......................................-0.3V to (VAVDD + 0.3V)
AGND to DGND.....................................................-0.3V to +0.3V
DIN, SCLK, CS, XIN, SYNC, DRDYIN,
CASCIN to DGND..............................-0.3V to (VDVDD + 0.3V)
DOUT, DRDYOUT, CASCOUT, CLKOUT,
XOUT to DGND..................................-0.3V to (VDVDD + 0.3V)
FAULT, OVRFLW to DGND ...................................-0.3V to +4.0V
AIN_+ to AIN_- ......................................................-6.0V to +6.0V
AIN_ _ to AGND (VAVDD ≥ 3V, VDVDD ≥ 2.7V, FAULTDIS = 0,
SHDN = 0, fXIN CLOCK ≥ 20MHz)......................-6.0V to +6.0V
AIN_ _ to AGND (VAVDD < 3V or VDVDD < 2.7V or FAULTDIS = 1
or SHDN = 1 or fXIN CLOCK < 20MHz) ..............-3.5V to +3.5V
REFIO, REF_ to AGND............................-0.3V to (VAVDD + 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
TSSOP (derated 13.7mW/°C above +70°C)..............1096mW
Operating Temperature Range .........................-40°C to +105°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 2)
MAX11040K
24
Resolution
MAX11060
16
Bits
Differential Nonlinearity
DNL
24-bit no missing code (MAX11040K);
16-bit no missing code (MAX11060)
0.1
LSB
TA = +25°C and +105°C (MAX11040K)
0.001
0.004
TA = -40°C (MAX11040K)
0.006
Integral Nonlinearity (Note 3)
INL
MAX11060
0.001
%FS
Offset Error
-1
+1
mV
Gain Error
(Note 4)
-1
+1
%FS
Offset-Error Drift
(Note 5)
0.5
ppm/°C
Gain-Error Drift
(Note 5)
1
ppm/°C
Change in Gain Error vs. fOUT
fOUT = 0.25ksps to 64ksps
< 0.025
% FS
Channel-to-Channel Gain Matching
0.03
% FS
DYNAMIC SPECIFICATIONS (62.5Hz sine-wave input, 2.17VP-P)
(Note 6) (MAX11040K)
103
106
Signal-to-Noise Ratio
SNR
(Note 6) (MAX11060)
94.5
dB
TA = +25°C and +105°C (MAX11040K)
-94
TA = -40°C (MAX11040K)
-90
Total Harmonic Distortion
THD
MAX11060
-106
dB
TA = +25°C and +105°C (MAX11040K)
93
98
TA = -40°C (MAX11040K)
89
Signal-to-Noise Plus Distortion
SINAD
MAX11060
94
dB
TA = +25°C and +105°C (MAX11040K)
94
100
TA = -40°C (MAX11040K)
89
Spurious-Free Dynamic Range
SFDR
MAX11060
100
dB
0.1%FS input (MAX11040K)
0.25
Relative Accuracy (Note 7)
6.0%FS input (MAX11040K)
0.005
%