Table 17 pro" />
參數(shù)資料
型號(hào)： MC8610PX1066JB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 20/96頁(yè)
文件大?。?/td> 0K
描述： MPU E600 CORE 1066MHZ 783-PBGA
標(biāo)準(zhǔn)包裝： 36
系列： MPC86xx
處理器類(lèi)型： 32-位 MPC86xx PowerPC
速度： 1.066GHz
電壓： 1V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤(pán)
Electrical Characteristics
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
27
Table 17 provides the DDR capacitance when GVDD (typ)=2.5 V.
Table 18 provides the current draw characteristics for MVREF.
2.6.2
DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR/DDR2 SDRAM interface.
2.6.2.1
DDR SDRAM Input AC Timing Specifications
Table 19 provides the input AC timing specifications for the DDR2 SDRAM when GVDD(typ)=1.8 V.
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
Notes:
1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.
2. MVREF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak
noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of MVREF.
4. Output leakage is measured with all outputs disabled, 0 V
≤ V
OUT ≤ GVDD.
Table 17. DDR SDRAM Capacitance for GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
68
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA =25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
Table 18. Current Draw Characteristics for MVREF
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Current draw for MVREF
IMVREF
—
500
μA1
Note:
1. The voltage regulator for MVREF must be able to supply up to 500 μA current.
Table 19. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—MVREF – 0.25
V
AC input high voltage
VIH
MVREF + 0.25
—
V
Table 16. DDR SDRAM DC Electrical Characteristics for GVDD (typ) = 2.5 V (continued)
Parameter/Condition
Symbol
Min
Max
Unit
Notes
相關(guān)PDF資料
PDF描述
345-012-523-204 CARDEDGE 12POS DUAL .100 GREEN
345-012-523-202 CARDEDGE 12POS DUAL .100 GREEN
345-012-523-201 CARDEDGE 12POS DUAL .100 GREEN
345-012-521-804 CARDEDGE 12POS DUAL .100 GREEN
345-012-521-802 CARDEDGE 12POS DUAL .100 GREEN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC8610PX1066JZ 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications
MC8610PX1067G 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8610PX1067J 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8610PX1333JB 功能描述:微處理器 - MPU REV 1.1 8610 1.025V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8610PX1333JZ 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*