參數(shù)資料
型號: MC8610PX1066JB
廠商: Freescale Semiconductor
文件頁數(shù): 92/96頁
文件大小: 0K
描述: MPU E600 CORE 1066MHZ 783-PBGA
標準包裝: 36
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.066GHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應商設備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Package Information
Freescale Semiconductor
92
4.2
Part Marking
Parts are marked as the example shown in Figure 58.
Figure 58. Part Marking for FC-PBGA Device
5
Package Information
This section details package parameters and dimensions.
5.1
Package Parameters for the MPC8610
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 pins. There are two
package options: leaded flip chip-plastic ball grid array (FC-PBGA) and RoHS lead-free (FC-PBGA).
Die size
8.5 mm × 9.7 mm
Package outline
29 mm × 29 mm
Interconnects
783
Pitch
1 mm
Minimum module height
2.18 mm
Maximum module height
2.7 mm
Total capacitor count
23 caps; 100 nF each
For leaded FC-PBGA (package option: PX)
Solder balls
63% Sn 37% Pb
Ball diameter (typical)
0.50 mm
For RoHS lead-free FC-PBGA (package option: VT)
Solder balls
96.5% Sn, 3.5% Ag
Ball diameter (typical)
0.50 mm
MC8610
wxxyyyyMz
TWLYYWW
MMMM
YWWLAZ
YWWLAZ is the assembly traceability code.
MMMM is the M00 (mask) number.
TWLYYWW is the test code.
Note:
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