參數(shù)資料
型號: MC92602ZTA
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: SPECIALTY MICROPROCESSOR CIRCUIT, PBGA196
封裝: MAPBGA-196
文件頁數(shù): 50/98頁
文件大小: 896K
代理商: MC92602ZTA
5-4
MC92602 SERDES Reference Manual
MOTOROLA
Phase Locked Loop (PLL) Power Supply Filtering
5.6
Phase Locked Loop (PLL) Power Supply Filtering
An analog power supply is required. The PLLAVDD signal provides power for the analog
portions of the PLL. To ensure stability of the internal clock, the power supplied to the PLL
is ltered using a circuit similar to the one shown in Figure 5-1. For maximum
effectiveness, the lter circuit is placed as close as possible to the PLLAVDD ball to ensure
it lters out as much noise as possible. The ground connection should be near the
PLLAGND ball. The 0.01
F capacitor is closest to the ball, followed by the 1 F capacitor,
and nally the 1
resistor to Vdd on the 1.8V power plane. The capacitors are connected
from PLLAGND to the ground plane. Use ceramic chip capacitors with the highest possible
self-resonant frequency. All traces should be kept short, wide and direct.
Figure 5-1. PLL Power Supply Filter Circuits
5.7
Power Supply Decoupling Recommendations
The MC92602 requires a clean, tightly regulated source of power to ensure low jitter on
transmit, and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used, to minimize inductance.
Connections from all capacitors to power and ground should be done with multiple vias to
further reduce inductance.
First, the board should have about 10 x 10nF SMT ceramic chip capacitors as close as
possible to the 1.8v (Vdd and XVdd) balls of the device. The board should also have about
10 x 10nF SMT ceramic chip capacitors as close as possible to the 1.5v (VDDQ) balls of the
device. Where the board has blind vias, these capacitors should be placed directly below
the MC92602 supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the MC92602, as close to the supply and
ground connections as possible.
Second, there should be a 1uF ceramic chip capacitor on each side of the MC92602 device.
This should be done for both the 1.8v supply and the 1.5v supply.
Third, between the MC92602 device and the voltage regulator, there should be a 10uF, low
equivalent series resistance (ESR) SMT tantalum chip capacitor, and a 100uF, low ESR
VDD
1
0.01 F
PLLAVDD
1.0 F
GND
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