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參數(shù)資料
| 型號： | MCZ33889BEG |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | System Basis Chip with Low Speed Fault Tolerant CAN Interface |
| 中文描述： | 系統(tǒng)基礎(chǔ)芯片與低速容錯CAN接口 |
| 文件頁數(shù)： | 56/60頁 |
| 文件大?。?/td> | 705K |
| 代理商： | MCZ33889BEG |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
56
33889
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33889 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33889 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (T
J
), and thermal resistance
(R
θ
JA
).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Figure 23. Surface Mount for SOIC Wide Body
Non-Exposed Pad
28-PIN
SOICW
33889DW
33889EG
DWB SUFFIX
EG SUFFIX (PB-FREE)
98ASB42345
28-PIN SOICW
NOTE
FOR PACKAGE DIMENSIONS,
REFER TO THE 33889 DEVICE DATASHEET.
T
J
=
R
θ
JA
.
P
Table 34. Thermal Performance Comparison
Thermal Resistance
[
°
C/W]
Ρ
θ
JA
(1)
(2)
Ρ
θ
JB
(2)
(3)
Ρ
θ
JA
(1)
(4)
42
11
69
Ρ
θ
Χ
(5)
23
Notes
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
2.
3.
4.
5.
20 Terminal SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCZ33889BEG | 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/CAN TRANCEIVER |
| MCZ33889BEG/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:System Basis Chip with Low Speed Fault Tolerant CAN Interface |
| MCZ33889BEGR2 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-LITE-LS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33889DEG | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-LITE-LS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33889DEG | 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/CAN TRANCEIVER |
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