參數(shù)資料
型號: MCZ33889BEG
廠商: 飛思卡爾半導體(中國)有限公司
英文描述: System Basis Chip with Low Speed Fault Tolerant CAN Interface
中文描述: 系統(tǒng)基礎芯片與低速容錯CAN接口
文件頁數(shù): 57/60頁
文件大?。?/td> 705K
代理商: MCZ33889BEG
Analog Integrated Circuit Device Data
Freescale Semiconductor
57
33889
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 24. Thermal Test Board
Device on Thermal Test Board
R
θ
JA
is the thermal resistance between die junction and
ambient air.
28-Pin SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
33889 Pin Connections
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
RTL
RTH
V2
RX
TX
RST
INT
GND
GND
GND
GND
V2CTRL
VSUP
HS1
L0
L1
VDD1
4
5
6
7
8
9
10
11
12
13
14
2
3
28
25
24
23
22
21
20
19
18
17
16
15
27
26
1
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area
A
:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 35. Thermal Resistance Performance
Thermal
Resistance
Area A (mm
2
)
(
°
C/W)
R
θ
JA
0
69
300
53
600
48
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相關代理商/技術參數(shù)
參數(shù)描述
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MCZ33889BEGR2 功能描述:網(wǎng)絡控制器與處理器 IC SBC-LITE-LS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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MCZ33889DEG 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/CAN TRANCEIVER