MK74ZD133
PLL and 32-Output Clock Driver
PRELIMINARY INFORMAT ION
MDS 74ZD133 C
Integrated Circuit Systems, Inc.525 Race StreetSan JoseCA95126(408)295-9800telwww.icst.com
8
Revision 010899
Printed 11/17/00
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Inc. (ICS) assumes no responsibility for either its use or for
the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements
are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any
ICS product for use in life support devices or critical medical instruments.
Ordering Information
Part/Order Number
MK74ZD133F
MK74ZD133FT
MK74ZD133Y
MK74ZD133YT
Marking
MK74ZD133F
MK74ZD133F
MK74ZD133Y
MK74ZD133Y
Package
Temperature
0 to 70 C
0 to 70 C
0 to 70 C
0 to 70 C
56 pin SSOP in tubes
56 SSOP in Tape & Reel
64 pin LQFP in trays
64 LQFP in Tape & Reel
Due to the large number of outputs capable
of running high speeds, the LQFP package
has an integrated heat slug to dissipate power.
When running the device above 105 MHz, or
with heavy (>15 pF) capacitive loads, it is
recommended to include a copper ground
pad, without anti-solder coating, underneath
the device. This will allow the PC board to
help in dissipating the heat created by the
MK74ZD133Y.
JEDEC VARIATION (All dimensions in millimeters)
BCD
MIN.
NOM.
MAX.
1.60
0.15
1.45
A
A1
A2
D
D1
E
E1
L
N
e
b
b1
ccc
ddd
0.05
1.35
1.40
12.00 BSC.
10.00 BSC.
12.00 BSC.
10.00 BSC.
0.60
64
0.50 BSC.
0.22
0.20
0.45
0.75
0.17
0.17
0.27
0.23
0.08
0.08
S
Y
M
B
O
L
Package Dimensions for 64 Pin LQFP
Layout Information for 64 pin LQFP