MAXIMUM RATINGS THERMAL RATINGS Package Oper" />
參數(shù)資料
型號(hào): MM908E624ACDWBR2
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 36/39頁(yè)
文件大?。?/td> 0K
描述: IC TRPL SWITCH MCU/LIN 54-SOIC
標(biāo)準(zhǔn)包裝: 1,000
應(yīng)用: 自動(dòng)鏡像控制
核心處理器: HC08
程序存儲(chǔ)器類型: 閃存(16 kB)
控制器系列: 908E
RAM 容量: 512 x 8
接口: SCI,SPI
輸入/輸出數(shù): 16
電源電壓: 5.5 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 54-BSSOP(0.295",7.50mm 寬)
包裝: 帶卷 (TR)
供應(yīng)商設(shè)備封裝: 54-SOIC
配用: KIT908E624DWBEVB-ND - KIT EVAL 908E624 TRPL W/MCU/LIN
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
908E624
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Package Operating Ambient Temperature (4)
MM908E624ACPEW
MM908E624AYPEW
TA
-40 to 85
-40 to 125
°C
Operating Junction Temperature (2)(4)
MM908E624ACPEW
MM908E624AYPEW
TJ
-40 to 125
°C
Storage Temperature
TSTG
-40 to 150
°C
Peak Package Reflow Temperature During Reflow(3)(5)
TPPRT
°C
Notes
2.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3.
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4.
Independent of TA, device parametrics are only guaranteed for -40 < TJ < 125 °C. Please see note 2. TJ is a factor of power dissipation,
package thermal resistance, and available heat sinking.
5.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
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