DYNAMIC ELECTRICAL CHARACTERISTICS LIN PHYS" />
參數(shù)資料
型號: MM908E624ACDWBR2
廠商: Freescale Semiconductor
文件頁數(shù): 4/39頁
文件大?。?/td> 0K
描述: IC TRPL SWITCH MCU/LIN 54-SOIC
標(biāo)準(zhǔn)包裝: 1,000
應(yīng)用: 自動鏡像控制
核心處理器: HC08
程序存儲器類型: 閃存(16 kB)
控制器系列: 908E
RAM 容量: 512 x 8
接口: SCI,SPI
輸入/輸出數(shù): 16
電源電壓: 5.5 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 54-BSSOP(0.295",7.50mm 寬)
包裝: 帶卷 (TR)
供應(yīng)商設(shè)備封裝: 54-SOIC
配用: KIT908E624DWBEVB-ND - KIT EVAL 908E624 TRPL W/MCU/LIN
Analog Integrated Circuit Device Data
12
Freescale Semiconductor
908E624
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
LIN PHYSICAL LAYER (CONTINUED)
Output Current Shutdown Delay
tOV-DELAY
—10
μs
SPI INTERFACE TIMING
SPI Operating Recommended Frequency
fSPIOP
0.25
4.0
MHz
L1 AND L2 INPUTS
Wake-up Filter Time (24)
tWUF
8.0
20
38
μs
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
Watchdog Period
External Resistor REXT = 10 kΩ (1%)
External Resistor REXT = 100 kΩ (1%)
Without External Resistor REXT (WDCONF Pin Open)
tPWD
97
10.558
99.748
150
205
ms
STATE MACHINE TIMING
Reset Low Level Duration after VDD High (28)
tRST
0.65
1.0
1.35
ms
Interrupt Low Level Duration
tINT
7.0
10
13
μs
Normal Request Mode Timeout (28)
tNRTOUT
97
150
205
ms
Delay Between SPI Command and HS1/HS2/HS3 Turn On (25), (26)
tS-HSON
—3.0
10
μs
Delay Between SPI Command and HS1/HS2/HS3 Turn Off (25), (26)
tS-HSOFF
—3.0
10
μs
Delay Between Normal Request and Normal Mode After W/D Trigger
Command (27)
tS-NR2N
6.0
35
70
μs
Delay Between SS Wake-Up (SS LOW to HIGH) and Normal Request Mode
(VDD On and Reset High)
tW-SS
15
40
80
μs
Delay Between SS Wake-Up (SS LOW to HIGH) and First Accepted SPI
Command
tW-SPI
90
N/A
μs
Delay Between Interrupt Pulse and First SPI Command Accepted
tS-1STSPI
30
N/A
μs
Minimum Time Between Two Rising Edges on SS
t2SS
15
μs
Notes
24.
This parameter is guaranteed by process monitoring but is not production tested.
25.
Delay between turn-on or turn-off command and high side on or high side off, excluding rise or fall time due to external load.
26.
Delay between the end of the SPI command (rising edge of the SS) and start of device activation/deactivation.
27.
This parameter is guaranteed by process monitoring but it is not production tested.
28.
Also see Figure 10 on page 15
Table 4. Dynamic Electrical Characteristics (continued)
All characteristics are for the analog chip only. Please refer to the 68HC908EY16 data sheet for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V VSUP 16 V, -40 °C TJ 125 °C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
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