參數(shù)資料
型號(hào): MPC106ARX83DE
廠商: MOTOROLA INC
元件分類: 總線控制器
英文描述: PCI Bridge/Memory Controller
中文描述: PCI BUS CONTROLLER, CBGA304
封裝: 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
文件頁(yè)數(shù): 20/28頁(yè)
文件大小: 158K
代理商: MPC106ARX83DE
20
MPC106 PCI Bridge/Memory Controller Hardware Specifications
Package Description
1.7 Package Description
The following sections provide the package parameters and the mechanical dimensions for the 106.
1.7.1 Package Parameters
The package parameters are as provided in the following list. The package type is a 21 mm x 25 mm,
304-lead C4 ceramic ball grid array (CBGA).
Package outline
21 mm x 25 mm
Interconnects
303 (16 x 19 ball array minus one)
Pitch
1.27 mm
Solder attach
63/37 Sn/Pb
Solder balls
10/90 Sn/Pb, 0.89 mm diameter
Maximum module height
3.16 mm
Co-planarity specification
0.15 mm
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