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      參數(shù)資料
      型號(hào): MPC106ARX83DE
      廠商: MOTOROLA INC
      元件分類: 總線控制器
      英文描述: PCI Bridge/Memory Controller
      中文描述: PCI BUS CONTROLLER, CBGA304
      封裝: 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
      文件頁(yè)數(shù): 25/28頁(yè)
      文件大?。?/td> 158K
      代理商: MPC106ARX83DE
      MPC106 PCI Bridge/Memory Controller Hardware Specifications
      25
      System Design Information
      Figure 14. Exploded Cross-Sectional View
      1.8.5.1 Internal Package Conduction Resistance
      For this C4/CBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
      The die junction-to-case thermal resistance
      The die junction-to-lead thermal resistance
      These parameters are shown in Table 13. In this C4/CBGA package, the silicon chip is exposed; therefore,
      the package “case” is the top of the silicon.
      Figure 15 provides a simplified thermal network in which a C4/CBGA package is mounted to a
      printed-circuit board.
      Figure 15. C4/CBGA Package Mounted to a Printed-Circuit Board
      Table 13. Thermal Resistance
      Thermal Metric
      Effective Thermal Resistance
      Junction-to-case thermal resistance
      0.133 °C/W
      Junction-to-lead (ball) thermal resistance
      3.8 °C/W
      Chip with C4 Encapsulant
      Ceramic Substrate
      CBGA Joint
      Printed-Circuit Board
      External Resistance
      External Resistance
      Internal Resistance
      (Note the internal versus external package resistance)
      Radiation
      Convection
      Radiation
      Convection
      Heat Sink
      Printed-Circuit Board
      Thermal Interface Material
      Package/Leads
      Die Junction
      Die/Package
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