- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371134 > MPC106ARX83DE (MOTOROLA INC) PCI Bridge/Memory Controller PDF資料下載
參數(shù)資料
| 型號： | MPC106ARX83DE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 總線控制器 |
| 英文描述： | PCI Bridge/Memory Controller |
| 中文描述： | PCI BUS CONTROLLER, CBGA304 |
| 封裝： | 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304 |
| 文件頁數(shù)： | 26/28頁 |
| 文件大?。?/td> | 158K |
| 代理商： | MPC106ARX83DE |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁當(dāng)前第26頁第27頁第28頁
26
MPC106 PCI Bridge/Memory Controller Hardware Specifications
System Design Information
1.8.5.2 Board and System-Level Modeling
A common figure-of-merit used for comparing the thermal performance of various microelectronic
packaging technologies is the junction-to-ambient thermal resistance. The final chip-junction operating
temperature is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component’s power consumption, a number of factors affect
the final operating die-junction temperature. For example, these factors might include airflow, board
population, heat sink efficiency, heat sink attach, next-level interconnect technology, and system air
temperature rise.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For this reason, we recommend using conjugate heat transfer models for
the board as well as system-level designs. To expedite system-level thermal analysis, several “compact”
CBGA thermal models are available on request within FLOTHERM
.
The die junction-to-ambient thermal resistance is shown in Table 14. The model results are in accordance
with SEMI specification G38. This standard specifies a single component be placed on a 7.5 cm x 10 cm
single-layer printed-circuit card. Note that this single metric may not adequately describe
three-dimensional heat flow.
Table 14. Die Junction-to-Ambient Thermal Resistance
Airflow Velocity
(Meter/Second)
Airflow Velocity
(Feet/Minute)
Die Junction-to-Ambient Thermal Resistance
(SEMI G38) (°C/W)
1
196.8
22.0
2
393.7
18.5
3
590.0
17.0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC106ARX83DG | PCI Bridge/Memory Controller |
| MPC106ARX83TE | PCI Bridge/Memory Controller |
| MPC106ARX83TG | PCI Bridge/Memory Controller |
| MPC2003SG50 | 256KB and 512KB BurstRAM Secondary Cache Module for PowerPC - Based Systems |
| MPC2002SG50 | 256KB and 512KB BurstRAM Secondary Cache Module for PowerPC - Based Systems |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC106ARX83DG | 制造商:Freescale Semiconductor 功能描述: |
| MPC106ARX83TE | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PCI Bridge/Memory Controller |
| MPC106ARX83TG | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PCI Bridge/Memory Controller |
| MPC-108 | 制造商:Greenlee Textron Inc 功能描述:Unspecified Tools & Accessories ADAPTER,MATING BULKHEAD |
| MPC108100J | 功能描述:厚膜電阻器 - 透孔 MPC10 10R 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。