參數(shù)資料
型號(hào)： MPC8241LZQ266D
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357
文件頁(yè)數(shù)： 5/64頁(yè)
文件大小： 827K
代理商： MPC8241LZQ266D
MOTOROLA
MPC8241 Integrated Processor Hardware Specifications
13
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
4.2 Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. To obtain more information, see
4.3 AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8241. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
Table 7 provides the operating frequency information for the MPC8241 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V.
Table 6. Thermal Characterization Data
Rating
Thermal Test Board
Description
Symbol
Value 7
(166- and
200-MHz
Parts)
Value 7
(266-MHz
Part)
Unit
Notes
Junction-to-ambient
natural convection
Single-layer board (1s)
RθJA
38
28
°C/W
1, 2
Junction-to-ambient
natural convection
Four-layer board (2s2p)
RθJMA
25
20
°C/W
1, 3
Junction-to-ambient
(@200 ft/min)
Single-layer board (1s)
RθJMA
31
22
°C/W
1, 3
Junction-to-ambient
(@200 ft/min)
Four-layer board (2s2p)
RθJMA
22
17
°C/W
1, 3
Junction-to-board
(bottom)
Four-layer board (2s2p)
RθJB
17
11
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
8
7
°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
2
°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per EIA/JESD51-2.
7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package,
which causes the two package types to have different thermal characterization data.
相關(guān)PDF資料
PDF描述
MPC8241LZP266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LVR200B 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
MPC8245ARZU400D 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MPC8241TVR200D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TZP166C 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Intergrated Processor Hardware Specifications
MPC8241TZP200C 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Intergrated Processor Hardware Specifications
MPC8241TZP266C 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Intergrated Processor Hardware Specifications
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