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參數(shù)資料
| 型號： | MPC8245ARVV400D |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352 |
| 文件頁數(shù)： | 47/68頁 |
| 文件大小： | 1143K |
| 代理商： | MPC8245ARVV400D |
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MPC8245 Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
51
System Design
7.8
Thermal Management
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks can be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.
Figure 29 displays a package-exploded cross-sectional view of a TBGA package with several heat sink
options.
Figure 29. Package-Exploded Cross-Sectional View with Several Heat Sink Options
Figure 30 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
from adjacent components.
A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from
adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high
board-level thermal loading from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low
board-level thermal loading from adjacent components.
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Adhesive or
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8245ARZU400D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8245ARZU400D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-352 |
| MPC8245ARZU466D | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series |
| MPC8245EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
| MPC8245ECS02AD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8245 Integrated Processor Hardware Specifications |
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