參數(shù)資料
型號(hào): MPC8275VR
廠商: Motorola, Inc.
英文描述: PowerQUICC II Family Hardware Specifications
中文描述: 的PowerQUICC II系列硬件規(guī)格
文件頁數(shù): 71/76頁
文件大?。?/td> 496K
代理商: MPC8275VR
MOTOROLA
MPC8280 PowerQUICC II Family Hardware Specifications
71
Package Description
9
Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1
Package Parameters
Package parameters are provided in Table 23.
1
Should be tied to VDDH via a 2K
external pull-up resistor.
2
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
3
Must be pulled down or left floating.
4
If PCI is not desired, must be pulled up or left floating.
5
Sphere is not connected to die.
6
GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Section 4.3, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can
leave the pin connected to GND with the noise filtering capacitors.
7
XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no
need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in
which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Table 23. Package Parameters
Package
Devices
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU
MPC8280
MPC8270
37.5 x 37.5
TBGA
480
1.27
1.55
VR
MPC8275VR
MPC8270VR
27 x 27
PBGA
516
1
2.25
ZQ
MPC8275ZQ
MPC8270ZQ
27 x 27
PBGA
516
1
2.25
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MPC8275VRMIBA 功能描述:微處理器 - MPU 266 MHz 505.4 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324