參數(shù)資料
型號(hào): MPC8313EVRAGDB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
封裝: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
文件頁(yè)數(shù): 61/100頁(yè)
文件大?。?/td> 1247K
代理商: MPC8313EVRAGDB
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
63
Package and Pin Listings
Figure 55 shows the SPI timing in master mode (internal clock).
Figure 55. SPI AC Timing in Master Mode (Internal Clock) Diagram
19 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in
a thermally enhanced plastic ball grid array (TEPBGAII), see Section 19.1, “Package Parameters for the
information on the TEPBGAII.
19.1
Package Parameters for the MPC8313E TEPBGAII
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm,
516 TEPBGAII.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
95.5 Sn/0.5 Cu/4 Ag (VR package),
62 Sn/36 Pb/2 Ag (ZQ package)
Ball diameter (typical)
0.6 mm
SPICLK (Output)
tNIIXKH
tNIKHOV
Input Signals:
SPIMISO
(See Note)
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
tNIIVKH
相關(guān)PDF資料
PDF描述
MPC8313VRAGDB 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
MPC8313VRAGDA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516
MPC8313VRAFFB 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
MPC8313CVRAFF 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
MPC8313ECVRAFF 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
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