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參數(shù)資料
| 型號(hào)： | MPC8313EVRAGDB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 |
| 文件頁數(shù)： | 85/100頁 |
| 文件大?。?/td> | 1247K |
| 代理商： | MPC8313EVRAGDB |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
85
Thermal
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, airflow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in Table 71. More detailed thermal
models can be made available on request.
Table 71. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow
Heat Sink Assuming Thermal Grease
Airflow
Thermal Resistance
(
°C/W)
Wakefield 53
× 53 × 2.5 mm pin fin
Natural convection
13.0
0.5 m/s
10.6
1 m/s
9.7
2 m/s
9.2
4 m/s
8.9
Aavid 35
× 31 × 23 mm pin fin
Natural convection
14.4
0.5 m/s
11.3
1 m/s
10.5
2 m/s
9.9
4 m/s
9.4
Aavid 30
× 30 × 9.4 mm pin fin
Natural convection
16.5
0.5 m/s
13.5
1 m/s
12.1
2 m/s
10.9
4 m/s
10.0
Aavid 43
× 41 × 16.5 mm pin fin
Natural convection
14.5
0.5 m/s
11.7
1 m/s
10.5
2 m/s
9.7
4 m/s
9.2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8313EVRAGDC | 功能描述:微處理器 - MPU 8313 REV2.2 W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8313EVRGDD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313EVRGDDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313EVRGDDB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313EVRGDF | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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