參數(shù)資料
型號： MPC8540VT833LC
廠商： Freescale Semiconductor
文件頁數(shù)： 82/104頁
文件大小： 0K
描述： MPU POWERQUICC III 783FCPBGA
標準包裝： 36
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 833MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 784-BBGA，F(xiàn)CBGA
供應商設備封裝： 783-FCPBGA（29x29）
包裝： 托盤
MPC8540 Integrated Processor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
79
Thermal
16.2 Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in Figure 45. The heat sink should be attached to the printed-circuit
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
Figure 45. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the MPC8540. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Junction-to-case thermal
RθJC
0.8
C/W
4
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal
resistance of the interface layer.
Table 59. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
Lid
Adhesive or
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