![](http://datasheet.mmic.net.cn/280000/MPX2202GVP_datasheet_16098581/MPX2202GVP_158.png)
3–12
Motorola Sensor Device Data
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Integration
ON-CHIP SIGNAL CONDITIONING
To make the designer’s job even easier, Motorola’s
integrated devices carry sensor technology one step further.
In addition to the on-chip temperature compensation and
calibration offered currently on the 2000 series, amplifier
signal conditioning has been integrated on-chipin the 4000,
5000 and 6000 series to allow interface directly to any
microcomputer with an on-board A/D converter.
The signal conditioning is accomplished by means of a
four-stage amplification network, incorporating linear bipolar
processing, thin-film metallization techniques, and interac-
tive laser trimming to provide the state-of-the-art in sensor
technology.
1.0 F
IPS
OUTPUT
3
5 V
0.01 F
2
1
Recommended Power Supply Decoupling.
For output filtering recommendations, please refer
to Application Note AN1646.
470 pF
Design Considerations for Different Levels of Sensor Integration
DESIGN ADVANTAGES
DESIGN CONSIDERATIONS
Uncompensated Sensors
High Sensitivity
Device–to–Device Variation in Offset
and Span
Lowest Device Cost
Temperature Compensation
Circuitry Required
Low–Level Output Allows Flexibility
of Signal Conditioning
Requires Signal Conditioning/
Amplification of Output Signal
Relatively Low Input Impedance
(400
Typical)
Temperature Compensated &
Calibrated (2000 Series)
Reduced Device–to–Device
Variations in Offset and Span
Lower Sensitivity Due to Span
Compensation (Compared to
Uncompensated)
Reduced Temperature Drift in Offset
and Span
Priced Higher than Uncompensated
Device
Reasonable Input Impedance
(2K
Typical)
Requires Signal Conditioning/
Amplification of Output Signal
Low Level Output Allows Flexibility in
Signal Conditioning
Integrated Pressure Sensors
(4000, 5000 and 6000 Series)
No Amplification Needed
Direct Interface to MPU
Priced Higher than Compensated/
Uncompensated Device
Signal Conditioning, Calibration of
Span and Offset, Temperature
Compensation Included On–Chip
F
Freescale Semiconductor, Inc.
n
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