
3–105
Motorola Sensor Device Data
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Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor oper-
ating characteristics, and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia, other than dry air, may have adverse effects on sensor
performance and long–term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
°
to
85
°
C using the decoupling circuit shown in Figure 4
.
The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
Figure 2. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
55
35
15
0
O
45
25
4.5
3.5
2.5
1.5
5
TRANSFER FUNCTION:
Vout = VS*0.018*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
1.0
0.5
50
30
10
40
20
MIN
TYPICAL
Figure 3. Cross–Sectional Diagram
(Not to Scale)
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
DIFFERENTIAL/GAUGE ELEMENT
P2
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY
PLASTIC
CASE
DIE
BOND
P1
Figure 4. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
F
Freescale Semiconductor, Inc.
n
.