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3–97
Motorola Sensor Device Data
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The MPX5010/MPXV5010G series piezoresistive
transducers are state–of–the–art monolithic silicon pres-
sure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or micro-
processor with A/D inputs. This transducer combines
advanced micromachining techniques, thin–film metal-
lization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the
applied pressure.
Features
5.0% Maximum Error over 0
°
to 85
°
C
Ideally Suited for Microprocessor or Microcontroller–
Based Systems
Durable Epoxy Unibody and Thermoplastic (PPS)
Surface Mount Package
Temperature Compensated over
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Available in Surface Mount (SMT) or Through–hole
(DIP) Configurations
40
°
to +125
°
C
Application Examples
Hospital Beds
HVAC
Respiratory Systems
Process Control
Figure 1. Fully Integrated Pressure
Sensor Schematic
VS
SENSING
ELEMENT
Vout
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS
FOR SURFACE MOUNT PACKAGE
PINS 4, 5, AND 6 ARE NO CONNECTS FOR
UNIBODY PACKAGE
SEMICONDUCTOR TECHNICAL DATA
MPXV5010GC7U
CASE 482C
MPXV5010GC6U
CASE 482A
MPXV5010G6U
CASE 482
INTEGRATED
PRESSURE SENSOR
0 to 10 kPa (0 to 1.45 psi)
0.2 to 4.7 V Output
SMALL OUTLINE PACKAGE
PIN NUMBER
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is noted by the notch
in the lead.
1
2
3
N/C
VS
Gnd
5
6
7
N/C
N/C
N/C
4
Vout
8
N/C
UNIBODY PACKAGE
MPX5010D
CASE 867
MPX5010DP
CASE 867C
PIN NUMBER
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the lead.
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
MPX5010GS
CASE 867E
Motorola Preferred Device
MPXV5010DP
CASE 1351
MPXV5010GP
CASE 1369
REV 9
F
Freescale Semiconductor, Inc.
n
.