參數(shù)資料
型號: MSP430F249MPMEP
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQFP64
封裝: GREEN, PLASTIC, QFP-64
文件頁數(shù): 16/81頁
文件大小: 1133K
代理商: MSP430F249MPMEP
MSP430F249-EP
MIXED SIGNAL MICROCONTROLLER
2008
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VCC to VSS
0.3 V to 4.1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin
0.3 V to VCC + 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal .
±2 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature§, Tstg:Unprogrammed device
55°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Programmed device
55°C to 125°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to
the TDI/TCLK pin when blowing the JTAG fuse.
§ Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
PARAMETER
MIN
MAX UNITS
Supply voltage during program execution, VCC
AVCC = DVCC = VCC (see Note 1)
1.8
3.6
V
Supply voltage during flash memory programming, VCC
AVCC = DVCC = VCC (see Note 1)
2.2
3.6
V
Supply voltage, VSS
AVSS = DVSS = VSS
0.0
V
Operating free-air temperature range, TA
55
125
°C
Flash temperature range
Read
55
125
°C
Flash temperature range
Write
55
125
°C
VCC = 1.8 V,
Duty cycle = 50% ± 10%
dc
4.15
Processor frequency fSYSYTEM (maximum MCLK frequency)
(see Notes 2 and 3 and Figure 1)
VCC = 2.7 V,
Duty cycle = 50% ± 10%
dc
12
MHz
VCC ≥ 3.3 V,
Duty cycle = 50% ± 10%
dc
16
NOTES: 1. It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can
be tolerated during power-up.
2. The MSP430 CPU is clocked directly with MCLK.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
3. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
4.15 MHz
12 MHz
16 MHz
1.8 V
2.2 V
2.7 V
3.3 V 3.6 V
Supply Voltage V
Sys
tem
Fr
eq
ue
nc
y
MHz
Supply voltage range
during flash memory
programming
Supply voltage range
during program execution
Legend:
7.5 MHz
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.2 V.
Figure 1. Operating Area
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