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Fairchild Semiconductor
[Rev. 1.10] 3/21/02
3
MSX Family Datasheet
Contents
1.
Introduction ........................................................................................................................... 7
1.1
Switch Matrix....................................................................................................................... 7
1.2
Input and Output Buffers (IOBs).......................................................................................... 8
1.2.1
I/O Port Function Mode ................................................................................................. 8
1.3
Control Signals....................................................................................................................11
1.4
RapidConfigure Interface ....................................................................................................11
1.4.1
Signal Description........................................................................................................ 11
1.4.2
Read and Reset Commands .......................................................................................... 13
1.4.3
Crosspoint Programming ............................................................................................. 16
1.4.4
IOB Configuration Programming................................................................................. 16
1.5
JTAG Interface ................................................................................................................... 18
1.5.1
IOB Programming........................................................................................................ 18
1.5.2
JTAG Architecture and Shift Registers ........................................................................ 20
1.5.3
JTAG State Machine .................................................................................................... 21
1.5.4
JTAG Input Format ...................................................................................................... 22
1.5.5
JTAG Instructions ........................................................................................................ 22
2.
Pin Description .....................................................................................................................24
3.
Electrical Specifications .......................................................................................................25
3.1
Absolute Maximum Ratings .............................................................................................. 25
3.2
Recommended Operating Conditions ................................................................................ 25
3.3
Pin Capacitance ................................................................................................................. 25
3.4
DC Electrical Specifications .............................................................................................. 26
3.5
AC Electrical Specifications .............................................................................................. 27
3.6
Test Circuit and Timing Diagrams ..................................................................................... 28
4.
Package and Pinout ..............................................................................................................33
4.1
MSX532 [792 TBGA Package] Pinout .............................................................................. 33
4.2
MSX532 [792 TBGA Package] Pinout: By Ball Sequence ................................................ 34
4.3
MSX532 [792 TBGA Package] Pinout: By Ball Name (alphabetically) ............................ 38
4.4
MSX340 [480 PBGA Package] Pinout .............................................................................. 42