512Mb: x4, x8, x16
DDR SDRAM
09005aef80a1d9e7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MBDDRx4x8x16_2.fm - Rev. H 7/04 EN
79
2000 Micron Technology, Inc. All rights reserved.
Figure 52: Bank Write - With Auto Precharge
NOTE:
1. DIn = data-out from column n; subsequent elements are provided in the programmed order.
2. Burst length = 4 in the case shown.
3. Enable auto precharge.
4. ACT = ACTIVE, RA = Row Address, BA = Bank Address.
5. NOP commands are shown for ease of illustration; other commands may be valid at these times.
CK
CK#
CKE
A10
BA0, BA1
tCK
tCH
tCL
tIS
tIH
tIS
tIH
tIS
tIH
RA
tRCD
tRAS
tRP
tWR
T0
T1
T2
T3
T4
T5
T5n
T6
T7
T8
T4n
NOP5
COMMAND4
3
ACT
RA
Col n
WRITE2
NOP5
Bank x
NOP5
Bank x
NOP5
tDQSL tDQSH tWPST
DQ1
DQS
DM
DI
b
tDS
tDH
tDQSS (NOM)
DON’T CARE
TRANSITIONING DATA
tWPRES tWPRE
x8: A12
x16: A11, A12
x4: A0–A9, A11, A12
x8: A0–A9, A11
x16: A0–A9
-5B
-6/-6T
-75E/75Z
-75
SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX UNITS
tCH
0.45 0.55 0.45 0.55 0.45 0.55
0.45
0.55
tCK
tCL
0.45 0.55 0.45 0.55 0.45 0.55
0.45
0.55
tCK
tCK (3)
5
7,5
NA
ns
tCK (2.5)
6
13
6
13
7.5
13
7.5
13
ns
tCK (2)
7.5
13
7.5
13
7.5
13
10
13
ns
tDH
0.45
0.5
ns
tDS
0.45
0.5
ns
tDQSH 0.35
0.35
tCK
tDQSL
0.35
tCK
tDQSS
0.72 1.28 0.75 1.25 0.75 1.25
0.75
1.25
tCK
tDSS
0.2
tCK
tDSH
0.2
tCK
tIH
S
0.75
0.8
1
ns
tIS
S
0.75
0.8
1
ns
tRAS
40
70,00
0
42
70,00
0
40
120,00
0
40
120,00
0
ns
tRCD
15
20
ns
tRP
15
20
ns
tWPRE 0.25
0.25
tCK
tWPRES
00
0
ns
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
tCK
tWR
15
ns
-5B
-6/-6T
-75E/75Z
-75
SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX UNITS