參數(shù)資料
型號(hào)： Pentium III cpu with mobile
廠商： Intel Corp.
英文描述： Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器)
中文描述： 奔騰III處理器的移動(dòng)模塊連接器2（絲裂霉素2）（帶移動(dòng)模塊連接器2奔三處理器）
文件頁數(shù)： 4/64頁
文件大?。?/td> 773K
代理商： PENTIUM III CPU WITH MOBILE
Pentium
III Processor Mobile Module MMC-2
iv
Datasheet
245304-003
5.3.3
5.3.4
Power Planes: Bulk Capacitance Requirements....................................34
System Power Supply Protection Guidelines.........................................36
5.3.4.1 DC Power System Protection....................................................36
5.3.4.2 V_DC Power Supply..................................................................37
5.3.4.3 Overcurrent Protection..............................................................37
5.3.4.4 Current Limit Shift Point ............................................................39
5.3.4.5 Slew Rate Control .....................................................................41
5.3.4.6 Undervoltage Lockout ...............................................................43
5.3.4.7 Overvoltage Lockout .................................................................44
Active Thermal Feedback ...................................................................................48
Thermal Sensor Configuration Register..............................................................48
5.4
5.5
6.0
Mechanical Specification..................................................................................................49
6.1
Module Dimensions.............................................................................................49
6.1.1
Pin 1 Location of the MMC-2 Connector................................................49
6.1.2
Printed Circuit Board..............................................................................50
6.1.3
Height Restrictions.................................................................................51
6.2
Thermal Transfer Plate .......................................................................................51
6.3
Module Physical Support ....................................................................................53
6.3.1
Module Mounting Requirements ............................................................53
6.3.2
Module Weight .......................................................................................54
7.0
Thermal Specification.......................................................................................................55
7.1
Thermal Design Power........................................................................................55
8.0
Labeling Information.........................................................................................................56
9.0
Environmental Standards.................................................................................................58
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Pentium III Processor Mobile Module Block Diagram...........................................3
MMC-2 Connector Pad Footprint ........................................................................19
Clock Control States ...........................................................................................24
BCLK Waveform at the Processor Core Pins .....................................................29
VR Efficiency Chart ............................................................................................31
Power Sequence Timing.....................................................................................34
V_DC Ripple Current ..........................................................................................36
V_DC Power System Protection Block Diagram.................................................37
Overcurrent Protection Circuit.............................................................................38
Current Shift Model.............................................................................................39
Undervoltage Lockout .........................................................................................43
Undervoltage Lockout Model ..............................................................................44
Overvoltage Lockout ...........................................................................................45
Overvoltage Lockout Model ................................................................................45
Recommended Power Supply Protection Circuit for the System Electronics .....47
Simulation of V_DC Voltage Skew......................................................................47
Board Dimensions and MMC-2 Connector Orientation.......................................49
Board Dimensions and MMC-2 Connector
—
Pin 1 Orientation...........................50
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