參數(shù)資料
型號(hào)： Pentium III cpu with mobile
廠商： Intel Corp.
英文描述： Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器)
中文描述： 奔騰III處理器的移動(dòng)模塊連接器2（絲裂霉素2）（帶移動(dòng)模塊連接器2奔三處理器）
文件頁(yè)數(shù)： 5/64頁(yè)
文件大?。?/td> 773K
代理商： PENTIUM III CPU WITH MOBILE
245304-003
Datasheet
v
Pentium
III Processor Mobile Module MMC-2
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Printed Circuit Board Thickness..........................................................................50
Keep-out Zone.....................................................................................................51
82443BX Thermal Transfer Plate (Reference Only) ..........................................52
82443BX Thermal Transfer Plate Detail..............................................................52
CPU Thermal Transfer Plate (Reference Only)...................................................53
Standoff Holes, Board Edge Clearance, and EMI Containment Ring .................54
Product Tracking Code........................................................................................57
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Connector Signal Summary ..................................................................................4
Memory Signal Descriptions..................................................................................6
AGP Signal Descriptions.......................................................................................7
PCI Signal Descriptions.........................................................................................9
Processor and PIIX4E/M Sideband Signal Descriptions.....................................11
Power Management Signal Descriptions ............................................................12
Clock Signal Descriptions....................................................................................13
Voltage Descriptions ...........................................................................................14
ITP and JTAG Pins..............................................................................................15
Miscellaneous Pin Descriptions...........................................................................15
Connector Pin Assignment..................................................................................16
Connector Specifications.....................................................................................19
Configuration Straps for the 82443BX Host Bridge System Controller...............21
Clock State Characteristics.................................................................................23
Power Consumption Values I..............................................................................27
Power Consumption Values II.............................................................................27
BCLK DC Specifications......................................................................................28
BCLK AC Specifications at the Processor Core Pins..........................................28
BCLK Signal Quality AC Specifications at the Processor Core...........................29
System Power Requirements..............................................................................30
Vcore Power Conversion Efficiency ...................................................................31
Voltage Signal Definitions and Sequences .........................................................32
VR_ON In-rush Current.......................................................................................33
Bulk Capacitance Requirements.........................................................................35
Thermal Sensor SMBus Address........................................................................48
Thermal Sensor Configuration Register..............................................................48
Thermal Design Power Specification ..................................................................55
Environmental Standards....................................................................................58
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