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參數(shù)資料
| 型號： | Pentium III cpu with mobile |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動模塊連接器2奔III處理器) |
| 中文描述： | 奔騰III處理器的移動模塊連接器2（絲裂霉素2）（帶移動模塊連接器2奔三處理器） |
| 文件頁數(shù)： | 41/64頁 |
| 文件大?。?/td> | 773K |
| 代理商： | PENTIUM III CPU WITH MOBILE |
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Pentium
III Processor Mobile Module MMC-2
245304-003
Datasheet
35
Table 24
details the bulk capacitance requirements for the system electronics.
Table 24. Bulk Capacitance Requirements
NOTES:
1. Placement of above capacitance requirements should be located near the connector.
2. V_CLK filtering should be located next to the system clock synthesizer.
3. The Ripple current specification depends on the V_DC input for the mobile module. See
Figure 7
below.
4. If Tantalum* Capacitors are used, a 50% voltage derating practice must be observed. For example, a 5.0-V
rail requires a 10.0-V rated capacitor.
5. In order to reduce ESR, Intel recommends the use of multiple bulk capacitors rather than a single large
capacitor.
6. Intel strongly recommends that system manufacturers pay close attention to capacitor design considerations.
Specifically, the "Capacitance vs. Temperature De-rating Curve," "Capacitance vs. Applied DC Voltage De-
rating Curve," and the "Capacitance vs. Frequency De-rating Curve." Some capacitor dielectrics are
particularly susceptible to these conditions, for example Y5V ceramic capacitors.
7. Specifications labeled N/A are not available.
Power
Plane
Bulk Capacitance Requirements
High Frequency Capacitance
Requirements
Notes
Total
Capacitance
ESR
Max
RMS Ripple
Current
V_DC
100.0
μ
F
20.0 m
3.0A~ 5.0A
0.1
μ
F, 0.01
μ
F
Notes 1,3,4,5,6
V_5
100.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3
470.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3S
100.0
μ
F
100.0 m
N/A
0.1
μ
F 0.01
μ
F
Notes 1,4,5,6
VCC_AGP
22.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_CPUPU
2.2
μ
F
N/A
N/A
8200.0 pF
Notes 1,5,6,7
V_CLK
10.0
μ
F
N/A
N/A
8200.0 pF
Notes 1,2,5,6,7
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