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參數(shù)資料
| 型號： | Pentium III cpu with mobile |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動模塊連接器2奔III處理器) |
| 中文描述： | 奔騰III處理器的移動模塊連接器2（絲裂霉素2）（帶移動模塊連接器2奔三處理器） |
| 文件頁數(shù)： | 57/64頁 |
| 文件大?。?/td> | 773K |
| 代理商： | PENTIUM III CPU WITH MOBILE |
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Pentium
III Processor Mobile Module MMC-2
245304-003
Datasheet
51
6.1.3
Height Restrictions
Figure 20
shows the mechanical stack-up and the associated component clearance requirements.
This is the module keep-out zone and should not be entered. The system manufacturer establishes
board-to-board clearance between the module and the system electronics by selecting one of three
mating connectors available in heights of approximately 4 mm, 6 mm, and 8 mm. The three sizes
provide flexibility in choosing the system electronics components between the two boards.
Information on these connectors can be obtained from your Intel sales representative.
Figure 20. Keep-out Zone
6.2
Thermal Transfer Plate
The thermal transfer plates (TTP) provide heat dissipation on the mobile Pentium
III
processor and
the 82443BX. The TTP may vary on different generations of Intel mobile modules. The TTP
provides the thermal attach point, where a system manufacturer can transfer heat through the
notebook system using a heat pipe, a heat spreader plate, or a thermal solution. Attachment
dimensions for the thermal interface block to the TTP are provided in
Figure 21
,
Figure 22
, and
Figure 23
. The TTP on the mobile module is designed to be a high efficiency spreader. To fully
take advantage of the mobile module thermal design and optimize the system thermal performance,
the contact area (Ac) needs to be a minimum of 30 mm x 30 mm. While it crucial to maximize the
contact area, it is equally important to ensure that the contact area and/or the mobile module is free
from warpage in an assembled configuration.
Warning:
If warpage occurs, the thermal resistance of the mobile module could be adversely affected.
When attaching a mating block to either TTP, Intel recommends that a thermal elastomer be used
as an interface material. This material reduces the thermal resistance. The OEM thermal interface
block should be secured to the CPU TTP with M2 screws using a maximum torque of 1.5 Kg*cm
to 2.0 Kg*cm (equivalent to 0.147 N*m to.197 N*m). The thread length of the M2 screws should
Note 3
Note 3
NOTES:
1.
2.
All values are nominal unless otherwise specified.
3D CAD model (PRO/E Native) Available upon
request.
These dimensions have changed.
3.
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| pentium III CPU | Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器) |
| pentium III processor | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| Pentium OverDrive Processor | Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術(shù)奔騰超速轉(zhuǎn)動處理器) |
| pentium pro processor | Pentium Pro Processor with 1MB L2 Cache at 200MHZ(1兆比特L2高速緩存頻率200兆赫茲處理器) |
| pentium processor with MMX | 32-bit processor with MMX technology(32位帶MMX技術(shù)處理器) |
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