參數(shù)資料
型號: PHN70308/T3
廠商: NXP SEMICONDUCTORS
元件分類: 小信號晶體管
英文描述: 5000 mA, 25 V, 7 CHANNEL, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, MO-150AH
封裝: PLASTIC, SSOP-28
文件頁數(shù): 3/10頁
文件大小: 132K
代理商: PHN70308/T3
Philips Semiconductors
Product specification
N-channel enhancement mode
PHN70308
TrenchMOS transistor array
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DS
Drain-source voltage
T
j = 25 C to 150C
-
25
V
DGR
Drain-gate voltage
R
GS = 20 k
-25
V
GS
Gate-source voltage
-
± 20
V
I
D
Peak drain current per device
T
sp = 50 C
1
(continuous operation)
spindle FETs;
δ = 33.3%
-
5
A
Isolation FET (dc)
-
5
A
I
DM
Peak current per device (pulse
spindle FETs
-
20
A
peak value)
isolation FET
-
20
A
P
tot
Power dissipation per device
2
T
sp = 50 C
spindle FETs;
δ = 33.3%
-
1.13
W
isolation FET (dc)
-
1.275
W
P
tot
Total power dissipation in normal
T
sp = 50 C
-
8
W
operation
2
spindle FETs;
δ = 33.3%
isolation FET (dc)
T
stg, Tj
Storage & operating temperature
- 55
150
C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
R
th j-sp
Thermal resistance junction to
isolation FET
20
-
K/W
solder point
spindle FET
43
-
K/W
R
th j-a
Thermal resistance junction to
device soldered to FR4 board,
ambient
minimum footprint.
isolation FET
85
-
K/W
spindle FET
100
-
K/W
1 T
sp is the temperature at the soldering point of the drain leads.
2 In normal operation, the isolation FET conducts continuously whilst each of the spindle FETs conducts for 33.3%
of the time. The dissipation in the isolation transistor is given by:-
The dissipation in each of the spindle transistors is given by:-
The total dissipation under these conditions is given by:-
With the motor being driven at 5 A and assuming T
j = 150C, the total dissipation is:-
Switching losses are assumed to be negligible.
P
isolation = I
2xR
DS
(ON)(isolationFET)
P
spindle = 0.333xI
2xR
DS
(ON)(spindleFET)
P
tot = Pisolation + 6xPspindle
P
tot = 25x 0.03x 1.7 + 0.333x 25x 0.08x 1.7x 6 = 8W
May 1999
2
Rev 1.000
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