參數(shù)資料
型號： RC28F160C3TC90
廠商： INTEL CORP
元件分類： PROM
英文描述： 1M X 16 FLASH 3V PROM, 90 ns, PBGA64
封裝： BGA-64
文件頁數(shù)： 1/72頁
文件大?。?/td> 1083K
代理商： RC28F160C3TC90
Order Number: 290645, Revision: 023
May 2005
Intel Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
The Intel Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13
m and 0.18 m technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel
Flash Data Integrator (Intel FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel
■
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
■
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
■
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
■
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
■
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware
block protection
■
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
■
Extended Temperature Operation
— -40 °C to +85 °C
■
128-bit Protection Register
— 64 bit unique device identifier
— 64 bit user programmable OTP cells
■
Extended Cycling Capability
— Minimum 100,000 block erase cycles
■
Software
— Supported by Intel’s Advanced Flash
File Managers -- Intel
VFM, Intel
FDI, etc.
— Code and data storage in the same
memory device
— Robust Power Loss Recovery for Data
Loss Prevention
— Common Flash Interface
— http://www.intel.com/go/flashsw
■
Standard Surface Mount Packaging
— 48-Ball
BGA*/VFBGA
— 64-Ball Easy BGA packages
— 48-TSOP package
■
ETOX VIII (0.13
m) Flash
Technology
— 8, 16, 32 Mbit
■
ETOX VII (0.18
m) Flash Technology
— 16, 32 Mbit
■
ETOX VI (0.25
m) Flash Technology
— 8, 16 and 32 Mbit
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相關代理商/技術參數(shù)
參數(shù)描述
RC28F160C3TD70 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Advanced+ Boot Block Flash Memory (C3)
RC28F160C3TD70A 功能描述:IC FLASH 16MBIT 70NS 64BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤
RC28F160C3TD70B 制造商:Micron Technology Inc 功能描述:16MB, ARMAGOSA EBGA 3.0
RC28F256J3A-110 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
RC28F256J3A-115 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
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