參數(shù)資料
型號(hào): RC28F160C3TC90
廠商: INTEL CORP
元件分類: PROM
英文描述: 1M X 16 FLASH 3V PROM, 90 ns, PBGA64
封裝: BGA-64
文件頁數(shù): 5/72頁
文件大?。?/td> 1083K
代理商: RC28F160C3TC90
Intel Advanced+ Boot Block Flash Memory (C3)
Datasheet
Intel Advanced+ Boot Block Flash Memory (C3)
May 2005
Order Number: 290645, Revision: 023
13
3.2
TSOP Package
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Figure 3.
TSOP Package Drawing and Dimensions
Dimensions
A5568- 02
A
0
L
Det ail A
Y
D
C
Z
Pin 1
E
D1
b
Detail B
See Det ail A
e
See Detail B
A1
A2
Seating
Plane
See Notes 1, 2, 3 and 4
Family: Thin Small Out
-Line Package
Symbol
Millimeters
Inches
Min
Nom
Max
Notes
Min
Nom
Max
Notes
Package Height
A
1.200
0.047
Standoff
A1
0.050
0.002
Package Body Thickness
A2
0.950
1.000
1.050
0.037
0.039
0.041
Lead Width
b
0.150
0.200
0.300
0.006
0.008
0.012
Lead Thickness
c
0.100
0.150
0.200
0.004
0.006
0.008
Plastic Body Length
D1
18.200 18.400 18.600
0.717
0.724
0.732
Package Body Width
E
11.800 12.000 12.200
0.465
0.472
0.480
Lead Pitch
e
0.500
0.0197
Terminal Dimension
D
19.800 20.000 20.200
0.780
0.787
0.795
Lead Tip Length
L
0.500
0.600
0.700
0.020
0.024
0.028
Lead Count
N
48
Lead Tip Angle
Seating Plane Coplanarity
Y
0.100
0.004
Lead to Package Offset
Z
0.150
0.250
0.350
0.006
0.010
0.014
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